Substrate and wafer bonding

Bonded substrate with electrodes

Bonding, a crucial step in MEMS and microfluidics

The crucial step in microfluidic device manufacturing is bonding, sealing and assembly. This is an especially challenging step for hybrid material bonding and for systems used in biological, pharmaceutical or medical applications.

Bonding solutions for different materials

Micronit offers various solutions for the bonding of polymer, glass, silicon and hybrid devices as well as for the development and finetuning processes that are specific to our customers’ applications. We provide solutions for porous membranes, flexible films, sensors and biosensors integration as well as for assembly, sealing, packaging and labelling of microfluidics devices.

Temperature dependent multiple bonding technologies

Temperature can be an important consideration in determining which bonding process to use. Bonding at low temperatures may have an advantage, when special coatings or polymers are temperature sensitive. For example, this applies to biological materials. Hermetically sealed bond interfaces can be achieved at room temperature with a novel laser-assisted process. In the case of product development, the application, cost and scalability are always considered, so that the right material and bounding process.



The following benefits can be obtained thanks to Micronit’s excellent bonding procedures:

  • Optimised functionality that meets your requirements;
  • Cost-effective (hybrid) materials selection, with properties tailored to the requirements of your application;
  • Temperature-specific bonding techniques that meet your application needs.