Silicon ribbed plates in a box


With its high-temperature resilience, excellent mechanical properties, and the possibility of integrating sensors and electronics, silicon is a much used material for microsystems. Silicon substrates can be very accurately structured with channels or pores, and silicon allows high aspect ratios.

Silicon is the right material when it comes to the integration of electronic circuits and CMOS, for example in bioMEMS applications. It allows combining CMOS technology with microtechnology and microfluidics, which are becoming essential traits of the newest labs-on-chips for health and life science applications.

Silicon is a good thermal conductor, especially compared to glass, which is thermally insulating. The ability to distribute heat effectively is essential, as the density of on-chip components increases. Other advantages of silicon are that it can be combined with other materials such as polymer and glass and that it offers great design flexibility whilst using the right micromachining techniques.

Silicon wafers

At Micronit, we process silicon wafers with diameters of 100 mm, 150 mm, or 200 mm.

  • Thickness: 0.1mm-2mm
  • Thermal resistance: up to 1414 °C
  • Chemical inertness: relatively inert. Does not react with oxygen, water, and most acids. Does react with dilute alkalis and halogens.
  • Surface roughness: no optical quality
  • Autofluorescence: extremely low
  • Refractive index: n = 3.38

Are you working on a silicon microfluidic device? Or would you like to discuss the best type of material for your project? Please, feel free to contact us directly. Our Sales and R&D teams will be happy to assist you!