Hybrid

Close-up hybrid bonded plate, polymer and integrated CMOS module

Hybrid

As microfluidic devices gain steadily in complexity, more often than not it is necessary to use multiple materials in one device. Thorough knowledge of these materials and the way they may or may not interact with one another is essential. Micronit creates platforms combining glass, silicon, or polymers and provides solutions for the integration of various components as well as for assembly, sealing, packaging and labelling of lab-on-a-chip devices.

This way, we serve customers that need microfluidic platforms that contain complex functionalities, for instance, sample prep steps like on-chip filtration, cell sorting, beads-based assays, mixing and volume metering as well as transducer integration in the form of sensors, electrodes, and actuators. We also provide solutions for CMOS integration, reagent integration, and for functionalities like droplet generation.

Generally, the most challenging part of creating a complex microfluidic platform is the bonding of this hybrid chip. Hybrid bonding is definitely one of Micronit’s key competencies. Micronit is experienced in the bonding of polymer, glass, silicon, and hybrid devices and can offer customer-specific bonding solutions when needed. We master a lot of different substrate bonding techniques, among which a fair part can be performed at lower temperatures, which is especially important when a chip is created to be used with delicate biological sample materials.

Making the right choice of materials and processes right from the start, is essential, especially in hybrid devices. Micronit is an excellent partner to advise you on these decisions.

Are you working on a hybrid microfluidic device? Or would you like to discuss the best combination of materials for your project? Please, feel free to contact us directly. Our Sales and R&D teams will be happy to assist you!