Foundry Capabilities
Microfluidic glass chips are manufactured by etching or powderblasting holes, cavities, microchannels and nanochannels in glass substrates. If required electrodes can be integrated in the devices. These substrates are then bonded and diced to create the individual devices. Our broad portfolio of micromachining technologies and years of experience make us an ideal outsourcing partner.
Capabilities
- 4”, 5”, and 6” substrate processing
- glass-etching (HF and DRIE)
- micropowderblasting
- structured MEMS wafers
- bonding (glass-to-glass, glass-to-silicon)
- thin glass handling
- metalization (Pt, Au, Cu, etc)
- plasma deposition
- surface modifications
- metrology
- dicing
- packaging and labelling