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Besides glass micromachining, we also process silicon substrates. Together with partners, we offer extensive silicon processing and serve our customers with creative but solid, reproducible solutions. Our DRIE etching facilities enable us to create deep, high density and high aspect ratio structures in silicon substrates.
In the prototyping phase it is crucial to design processes that are compatible with mass production wafer fabrication. Micronit understands the silicon processes and design constraints in these wafer fabs. Therefore Micronit is the ideal partner for prototyping your silicon microfluidic parts, and transferring it seamlessly to mass production.
Bonding Glass to Silicon
Micronit can bond glass to silicon or glass to glass to silicon. This is often used in MEMS applications such as wavel level packaging
Contact us for your customized silicon lab-on-a-chip devices!