Multi-Stack Bonding of Glass Wafers

Micronit has expanded its bonding capabilities with a new technology: Multi-layer bonding. Based on years of experience and high quality processes, we are able to fusion bond over 20 glass wafers into a monolithic glass device.

Multi-layers expands the way your device can be designed:

• Parallelize and scale up channels
• Combine more functionalities
• Have more freedom in creating 3D structures

Multi-layer devices provide several advantages when scaling up your throughput:

• Fully integrated interconnection by sophisticated manifold design
• Drastic decrease of interfacing and tubing material
• Reduced dead volume

Microreactors
The development of the technology was initiated by our activities in the microreactor market for pharmaceutical and (fine-)chemical industries. By stacking glass substrates internal volumes are obtained of over 100 ml. This achievement opens a new road for high throughput continuous flow reactors. Read more.