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Micronit's strength is the combination of different technologies for the development of high quality microfluidic devices. Thanks to our technology platform we can be a lab-on-a-chip foundry for various customer groups.
Below we will describe the different steps to get from a glass wafer to microfluidic chips.
GLASS SPECIFICATIONS
Micronit uses glass as basic material for its products, but can also combine glass with silicon for hybrid microfluidic devices.
MicROSTRUCTURING
Microfluidic glass chips are developed by etching and powderblasting holes, cavities and channels in glass substrates. Micronit applies different technologies.
INTEGRATING ELECTRODES
Micronit has developed a special proprietary technique to integrate electrodes in her glass chips, e.g. inside channels and reservoirs.
Surface Modification
By using a proprietary ultra thin surface treatment method, Micronit can modify the glass surface in the channels.
Bonding
Micronit is one of the few companies in microtechnology that offers direct glass to glass and glass to silicon bonding (without an intermediate layer).
Breaking & Dicing
For dividing the bonded substrates into individual microfluidic glass chips, Micronit uses two techniques: breaking and dicing.
Microfluidic Connections
For the connection of glass microfluidic devices to each other or to external equipment, Micronit offers several solutions.
LASER DRILLING Using a special laser holes of 4-50 μm can be fabricated with
high aspect ratios.