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Microfluidic glass chips are manufactured by etching or powderblasting holes, cavities, microchannels and nanochannels in glass substrates. If required electrodes can be integrated in the devices. These substrates are then bonded and diced to create the individual devices. Our broad portfolio of micromaching technologies and years of experience make us an ideal outsourcing partner.
Contact our engineers to discuss the possibilities for you devices.
MICROSTRUCTURING
Microfluidic glass chips are developed by etching and powderblasting holes, cavities and channels in glass substrates. Micronit applies different technologies.
INTEGRATING ELECTRODES
Micronit has developed a special proprietary technique to integrate electrodes in her glass chips, e.g. inside channels and reservoirs.
Surface Modification
By using a proprietary ultra thin surface treatment method, Micronit can modify the glass surface in the channels.
packed chip columns
To increase surface area chips can be packed with particles. Applications include packed microreactors and column chromatography.
Microfluidic Connections
For the connection of glass microfluidic devices to each other or to external equipment, Micronit offers several solutions.
GLASS SPECIFICATIONS
Micronit uses glass as basic material for its products, but can also combine glass with silicon for hybrid microfluidic devices.
Bonding
Micronit is one of the few companies in microtechnology that offers direct glass to glass and glass to silicon bonding (without an intermediate layer).
Breaking & Dicing
For dividing the bonded substrates into individual microfluidic glass chips, Micronit uses two techniques: breaking and dicing.
Structured Wafers
Structured glass wafers for MEMS applications (e.g. wafer level packaging).
LASER DRILLING
Using a special laser holes of 4-50 μm can be fabricated with
high aspect ratios.