The new packaging enables highly sensitive thermal flow sensor chips to measure through channel wall inside microfluidic chips. This can be done as a result of the high sensitivity achieved using digital CMOSens Technology.

The tiny, digital CMOSens chip (2.2 x 3.5 mm) which is bonded to the microfluidic glass chip (sample 10 x 15 mm) contains the full digital intelligence and even the memory required for signal linearization, temperature compensation, and self-test algorithms. It provides a fully digital I²C interface and can be powered with 2.8 - 3.3V.

Electrical contacts are established via metallic circuitries on the top layer of the glass chip from Micronit.

This new technology has the potential to be applied on a wide range of lab-on-a-chip products. Extremely small and efficient flow sensing solutions become available and no further signal processing is required because the sensor chip provides already a fully calibrated, digital output.

The flow sensing response time is about 50ms only and sensor resolutions down to 0.5 nl/min are possible which opens up new process monitoring options without changing the microfluidic system. Micronit has supported the development of this technology with its unique combination of expertise in glass micromachining and experience in metal layer manufacturing.