Micronit Microfluidics has set up an extensive development and production process for glass chip manufacturing. This process is specialized for rapid prototyping with low setup cost. Customized microfluidic devices can be supplied within weeks.
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One of the critical success factors in the trajectory from idea to application is design. An intelligent design contributes heavily to the success of the application. By letting Micronit take care of the design and engineering part, your first prototypes will not scatter from common microfluidic design flows. Micronit's chip designs enable them to be prototyped and produced in the most efficient way. These two important competences will save time and money.
Micronit already designs towards the most economical solution, concerning used materials, processes and size. This will be beneficial for higher volumes.
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From Wafers...
Micronit does not process individual chips, but wafers of 4 inch or 5 inch square. Due to substrate handling and alignment marks, the edges (5 mm at each side) of the substrate cannot be used for holes or channels. This leaves an effective design area of 90 x 90 mm or 115 x 115 mm (see figure).
To reduce costs, one should try to get as many chips out of a substrate as possible. The standard Micronit chip pattern is one of 45 x 15 mm with a maximum of ten fluidic interconnections. The channel pattern can always be used flexible; not every hole needs to be connected. Please contact us for more information on the chip designs.
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The glass chips in their simplest form are made out of two glass substrates.
In one substrate the channels are etched, in the other one through-holes for fluidic interconnection are made. The two substrates are bonded upon each other (see figure below) and the chips are diced.
The substrates thickness is standard 1.1 mm or 700 µm, but we can process glass down to 100 µm. For making the fluidic interconnection holes please take a look at the powderblasting section. The channels can be manufactured by HF etching, powderblasting or DRIE etching. More information on these technologies and on the bonding process can be found here.
High Volume
Micronit is not only capable of rapid prototyping, but also of providing high volume microfluidic devices. Thanks to our own cleanroom equipment and powderblasting machinery we are able to process up to 1,000 wafers a month. Please contact us for more information.